一、公司簡介
About Teradyne
Teradyne (NYSE:TER) is the world's largest supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. Teradyne provide test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as cells in system-on-a-chip (SOC) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and Internet applications. We deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. Teradyne was founded at Boston in 1960. With the development of global testing business, we established the Teradyne Shanghai Co. Ltd. in China in 2001. And we also have an extension office of Application Development Center in Hefei in 2007 in order to satisfy the ever growing business demand. In 2013, Teradyne had sales of $1.43 billion and currently employs about 3,800 people worldwide.
泰瑞達(dá)公司
泰瑞達(dá)(美國紐約證券交易所上市企業(yè))是全球的集成電路自動(dòng)測試設(shè)備供應(yīng)商。產(chǎn)品主要是用于半導(dǎo)體、板卡及電子系統(tǒng)的測試平臺(tái)。泰瑞達(dá)為包括處理器、微控制器、消費(fèi)類電子產(chǎn)品、汽車電子、存儲(chǔ)器、混合訊號(hào)IC、片上系統(tǒng)、射頻身份識(shí)別IC及通信系統(tǒng)在內(nèi)的電子產(chǎn)品提供優(yōu)質(zhì)高效的測試方案。泰瑞達(dá)的客戶均為全球頂尖的半導(dǎo)體、電子、自動(dòng)化及通訊設(shè)備廠商。在半導(dǎo)體測試設(shè)備供應(yīng)商中，泰瑞達(dá)是能覆蓋模擬,混合信號(hào),存儲(chǔ)器及VLSI器件等所有領(lǐng)域的。泰瑞達(dá)成立于1960年，總部設(shè)于美國馬薩諸塞州首府波士頓。隨著全球測試業(yè)務(wù)的發(fā)展，泰瑞達(dá)2001年在上海成立中國總公司，于2007在合肥設(shè)立了應(yīng)用開發(fā)部門的分支機(jī)構(gòu)以滿足日益增長的業(yè)務(wù)需求。2013年，泰瑞達(dá)全球銷售總額達(dá)14億美元。目前，全球員工約3800名。
二、招聘崗位
(一)Applications Engineer (應(yīng)用開發(fā)工程師)
Organization: Center Engineering Organization, China Application Development Center (ADC)
Work Location: Hefei (合肥)
Job Description
1、Develop highly sophisticated SOC test solutions(circuit design, signal processing, programming, debug,…similar to Embedded System Design)for world-wide customers
2、Provide innovative engineering solutions to conquer unique challenges
3、Fly overseas to personally install your solution on-siteCollaborate with overseas experts on a daily basis
Requirements
1、Bachelors or Master’s degree in Electronic Engineering or similar areas
2、Knowledge of Digital Signal Processing is desirable
3、Experience in analysis and debug of digital/analog circuits
4、Unix/C/C++ or Windows/VB programming experience
5、Excellent interpersonal and teamwork skills.
6、Experienced in problem solving
7、Excellent spoken and written English communication skills
8、Automatic Testing Equipment experience will be a plus.
(二)Software Engineer (軟件工程師)
Organization: Center Engineering Organization, China Application Development Center (ADC)
Work Location: Hefei (合肥)
Job Description
1、Unix/Linux Operating System programming
2、Design plugin for Automatic Test Equipment with C, C++ or .NET platform
3、Develop platform to platform converters with perl, C# or VB.net
4、Responsible for the full cycle of software development – investigation tasks, initial design, development, bug fixing, quality engineering,documentation, and maintenance
Requirements
1、Bachelor degree in Computer Science or Software Engineering. Master degree is desirable.
2、Must possess a strong understanding of Compiling Fundamental and Object-Oriented Programming.
3、Must possess a minimum of 1+ years experience in software development.
4、Must possess a good understanding of Software Engineering theories and methodologies.
5、Familiar with Microsoft .Net Platform.
6、Familiar with C#, C++, C, VB, Python, Perl and other programming language.
7、Familiar with Microsoft Windows, Sun Solaris Unix and Linux system.
8、ATE experience will be a plus.
9、Good command of spoken and written English.
10、Strong self-motivation and good communication skills.
(三)Hardware Design Engineer (硬件研發(fā)工程師)
Organization: Global Hardware Business Unit, China Hardware Design Center (HDC)
Work Location: Hefei (合肥)
Role Summary/Purpose
Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology, work here can be challenging and exciting.
Job Description
1、Design semiconductor test hardware solutions of next generation semiconductor devices for world-wide customers
2、Provide global hardware design support and consulting
3、Give global hardware infrastructure support and consulting
4、Deliver hardware design training and seminars to customers
5、Do hardware project management
6、Keep close communication with worldwide Teradyne teams and customers
Requirements
1、Master’s or Bachelor's degree in Electronic Engineering,MicroElectronics, Mechatronics, Communication Engineering, Automation,Instrumentation and Measurement, Biomedical engineering or similar major related to circuit design or hardware engineering
2、Good knowledge and understanding of electronic circuit theory and application
3、Experience in one or more EDA tools, such as Cadence, OrCAD, Protel, PADS or Mentor Graphics
4、Knowledge and experience in multi-layer board design
5、Knowledge and experience in embedded system design
6、Good communication skills, good written and oral English
7、Ability to effectively solve problems, open minded
8、Ability to successfully work in a team, cross-functional environment
9、Ability to travel oversea for extended period of time Knowledge/Experience in the following areas is a plus
1、High-speed design and RF circuitry design
2、Simulation tools and application, such as Siwave, HFSS, Sigrity
3、FPGA design and programming/debugging(VHDL, Verilog)
4、Mechanical design, familiar with one or more CAD tool, like Solid works,AutoCAD
5、One or more programming/script language(C, VB, Perl, Python)
6、Signal integrity(SI) theory and application
7、Design For Manufacturing(DFM)
8、German, Japanese or Korean language skill
三、聯(lián)系方式
歡迎電子科學(xué)與技術(shù)、電子信息工程、微電子、機(jī)械電子、通信、自動(dòng)化、儀器與測量、生物醫(yī)學(xué)工程等相關(guān)專業(yè)同學(xué)投遞簡歷，請(qǐng)關(guān)注院校宣講會(huì)信息現(xiàn)場投遞簡歷或?qū)⒑啔v投遞至：hr.recruiting.shanghai@teradyne.com
備注：投遞簡歷時(shí)，請(qǐng)?jiān)卩]件的主題里注明：畢業(yè)學(xué)校+應(yīng)聘職位“硬件研發(fā)工程師” 或“應(yīng)用開發(fā)工程師”或“軟件工程師”。
About Teradyne
Teradyne (NYSE:TER) is the world's largest supplier of semiconductor test equipment for logic, RF, analog, power, mixed-signal, and memory technologies. Teradyne provide test solutions to developers and manufacturers of a broad range of integrated circuits, packaged separately or integrated as cells in system-on-a-chip (SOC) devices. ICs tested by Teradyne are used in computing, communications, consumer, automotive, identification, and Internet applications. We deliver competitive advantage to the world's leading semiconductor, electronics, automotive and network systems companies. Teradyne was founded at Boston in 1960. With the development of global testing business, we established the Teradyne Shanghai Co. Ltd. in China in 2001. And we also have an extension office of Application Development Center in Hefei in 2007 in order to satisfy the ever growing business demand. In 2013, Teradyne had sales of $1.43 billion and currently employs about 3,800 people worldwide.
泰瑞達(dá)公司
泰瑞達(dá)(美國紐約證券交易所上市企業(yè))是全球的集成電路自動(dòng)測試設(shè)備供應(yīng)商。產(chǎn)品主要是用于半導(dǎo)體、板卡及電子系統(tǒng)的測試平臺(tái)。泰瑞達(dá)為包括處理器、微控制器、消費(fèi)類電子產(chǎn)品、汽車電子、存儲(chǔ)器、混合訊號(hào)IC、片上系統(tǒng)、射頻身份識(shí)別IC及通信系統(tǒng)在內(nèi)的電子產(chǎn)品提供優(yōu)質(zhì)高效的測試方案。泰瑞達(dá)的客戶均為全球頂尖的半導(dǎo)體、電子、自動(dòng)化及通訊設(shè)備廠商。在半導(dǎo)體測試設(shè)備供應(yīng)商中，泰瑞達(dá)是能覆蓋模擬,混合信號(hào),存儲(chǔ)器及VLSI器件等所有領(lǐng)域的。泰瑞達(dá)成立于1960年，總部設(shè)于美國馬薩諸塞州首府波士頓。隨著全球測試業(yè)務(wù)的發(fā)展，泰瑞達(dá)2001年在上海成立中國總公司，于2007在合肥設(shè)立了應(yīng)用開發(fā)部門的分支機(jī)構(gòu)以滿足日益增長的業(yè)務(wù)需求。2013年，泰瑞達(dá)全球銷售總額達(dá)14億美元。目前，全球員工約3800名。
二、招聘崗位
(一)Applications Engineer (應(yīng)用開發(fā)工程師)
Organization: Center Engineering Organization, China Application Development Center (ADC)
Work Location: Hefei (合肥)
Job Description
1、Develop highly sophisticated SOC test solutions(circuit design, signal processing, programming, debug,…similar to Embedded System Design)for world-wide customers
2、Provide innovative engineering solutions to conquer unique challenges
3、Fly overseas to personally install your solution on-siteCollaborate with overseas experts on a daily basis
Requirements
1、Bachelors or Master’s degree in Electronic Engineering or similar areas
2、Knowledge of Digital Signal Processing is desirable
3、Experience in analysis and debug of digital/analog circuits
4、Unix/C/C++ or Windows/VB programming experience
5、Excellent interpersonal and teamwork skills.
6、Experienced in problem solving
7、Excellent spoken and written English communication skills
8、Automatic Testing Equipment experience will be a plus.
(二)Software Engineer (軟件工程師)
Organization: Center Engineering Organization, China Application Development Center (ADC)
Work Location: Hefei (合肥)
Job Description
1、Unix/Linux Operating System programming
2、Design plugin for Automatic Test Equipment with C, C++ or .NET platform
3、Develop platform to platform converters with perl, C# or VB.net
4、Responsible for the full cycle of software development – investigation tasks, initial design, development, bug fixing, quality engineering,documentation, and maintenance
Requirements
1、Bachelor degree in Computer Science or Software Engineering. Master degree is desirable.
2、Must possess a strong understanding of Compiling Fundamental and Object-Oriented Programming.
3、Must possess a minimum of 1+ years experience in software development.
4、Must possess a good understanding of Software Engineering theories and methodologies.
5、Familiar with Microsoft .Net Platform.
6、Familiar with C#, C++, C, VB, Python, Perl and other programming language.
7、Familiar with Microsoft Windows, Sun Solaris Unix and Linux system.
8、ATE experience will be a plus.
9、Good command of spoken and written English.
10、Strong self-motivation and good communication skills.
(三)Hardware Design Engineer (硬件研發(fā)工程師)
Organization: Global Hardware Business Unit, China Hardware Design Center (HDC)
Work Location: Hefei (合肥)
Role Summary/Purpose
Hardware design engineer will closely work with worldwide engineers to perform engineering works for hardware testing solution of next generation semiconductor devices. The work includes requirement analysis, feasibility study, task planning, project management, design execution, quality control and verification. We are working on cutting edge requirement and future technology, work here can be challenging and exciting.
Job Description
1、Design semiconductor test hardware solutions of next generation semiconductor devices for world-wide customers
2、Provide global hardware design support and consulting
3、Give global hardware infrastructure support and consulting
4、Deliver hardware design training and seminars to customers
5、Do hardware project management
6、Keep close communication with worldwide Teradyne teams and customers
Requirements
1、Master’s or Bachelor's degree in Electronic Engineering,MicroElectronics, Mechatronics, Communication Engineering, Automation,Instrumentation and Measurement, Biomedical engineering or similar major related to circuit design or hardware engineering
2、Good knowledge and understanding of electronic circuit theory and application
3、Experience in one or more EDA tools, such as Cadence, OrCAD, Protel, PADS or Mentor Graphics
4、Knowledge and experience in multi-layer board design
5、Knowledge and experience in embedded system design
6、Good communication skills, good written and oral English
7、Ability to effectively solve problems, open minded
8、Ability to successfully work in a team, cross-functional environment
9、Ability to travel oversea for extended period of time Knowledge/Experience in the following areas is a plus
1、High-speed design and RF circuitry design
2、Simulation tools and application, such as Siwave, HFSS, Sigrity
3、FPGA design and programming/debugging(VHDL, Verilog)
4、Mechanical design, familiar with one or more CAD tool, like Solid works,AutoCAD
5、One or more programming/script language(C, VB, Perl, Python)
6、Signal integrity(SI) theory and application
7、Design For Manufacturing(DFM)
8、German, Japanese or Korean language skill
三、聯(lián)系方式
歡迎電子科學(xué)與技術(shù)、電子信息工程、微電子、機(jī)械電子、通信、自動(dòng)化、儀器與測量、生物醫(yī)學(xué)工程等相關(guān)專業(yè)同學(xué)投遞簡歷，請(qǐng)關(guān)注院校宣講會(huì)信息現(xiàn)場投遞簡歷或?qū)⒑啔v投遞至：hr.recruiting.shanghai@teradyne.com
備注：投遞簡歷時(shí)，請(qǐng)?jiān)卩]件的主題里注明：畢業(yè)學(xué)校+應(yīng)聘職位“硬件研發(fā)工程師” 或“應(yīng)用開發(fā)工程師”或“軟件工程師”。